Scie à fil diamanté pour outils diamantés de coupe de pierre

Thin Diamond wire for stone cutting

With self-developed diamond wire production equipment and highly automated production lines, and mastering the whole core production process of diamond wire, we can develop customized special diamond wire for stone cutting with stronger cutting capacity, good stability, strong adaptability and high cutting efficiency. We will conduct continuous research and development in accordance with customer needs.

1. Excellent cutting performance
2. The diamond particles on the wire have high hardness and strong wear resistance, which can efficiently cut hard and brittle materials such as stone. It has high cutting efficiency, and the cutting surface is flat and smooth, reducing subsequent processing procedures.
3. Different diameter specifications can meet different cutting requirements. For example, finer wire diameters are suitable for precision cutting, while coarser wire diameters are suitable for rapid cutting of large-volume materials.
4. Long service life
5. The electroplating process makes the diamond particles firmly attached to the wire. Compared with other types of cutting wires, the diamond shedding rate is low. It can maintain stable cutting ability during continuous cutting operations, reducing the replacement frequency.
6. Wide range of applications
7. In addition to stone cutting, it can also be used for cutting hard and brittle materials such as ceramics, glass, and semiconductor silicon wafers. It can play a role in various fields such as building decoration, stone processing, and electronic manufacturing.
8. Easy to operate
9. The wire has high flexibility, which is convenient for operation in complex cutting paths. When used with dedicated cutting equipment, it can achieve precise cutting operations, and the technical requirements for operators are relatively user-friendly.
10. Equipment Adaptation and Installation
11. Select dedicated cutting equipment that matches the wire diameter of the electroplated diamond wire, ensuring that the equipment's tension adjustment and wire guiding devices are compatible with the wire specifications.
12. When installing, wind the wire evenly onto the equipment's wire reel, adjust the wire tension to the value recommended by the equipment, avoiding excessive tension that may cause wire breakage or insufficient tension that affects cutting accuracy.
13. Pre-cutting Preparation
14. Select the corresponding diameter electroplated diamond wire according to the cutting material (such as stone, ceramic, silicon wafer, etc.) and cutting requirements (precision cutting or rapid cutting). For example, choose 0.45mm and 0.50mm diameter wires for precision cutting, and 0.55mm and 0.60mm diameter wires for rapid cutting.
15. Clean the dust and impurities on the surface of the cutting workpiece, ensure the cutting path is clear, and spray an appropriate amount of coolant in the cutting area to cool down, lubricate, and reduce dust.
16. Cutting Operation Points
17. After starting the equipment, slowly introduce the wire into the cutting workpiece, keeping the wire running uniformly and steadily, avoiding sudden pressure or rapid pulling of the wire.
18. During the cutting process, continuously observe the wire condition. If the wire vibrates or the cutting surface is uneven, adjust the equipment parameters or check if the wire is worn in time.
19. Post-cutting Treatment
20. After cutting is completed, first turn off the equipment power, wait until the wire stops running completely, and then move the wire away from the workpiece.
21. Clean up the debris generated during cutting, clean the wire to remove the residual coolant and impurities on the surface, and then store it properly to avoid squeezing and bending of the wire.

If you have any questions about cutting specific materials or equipment operation, feel free to communicate with me at any time~

Spec.& ModelFinished wire diameter (mm)Breaking force(N)Purpose0.60mm electroplated diamond wireΦ0.60±0.03≥450Slicing of stone0.55mm electroplated diamond wireΦ0.55±0.03≥400Slicing of stone0.50mm electroplated diamond wireΦ0.50±0.02≥380Slicing of stone0.45mm electroplated diamond wireΦ0.45±0.02≥280Slicing of stone